中文版 | English

在结果中检索

OPT OpenIR

浏览/检索结果: 共5条，第1-5条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：283/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：248/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：252/0  |  提交时间：2015/12/04
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：412/1  |  提交时间：2017/07/18
Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste 期刊论文
JOURNAL OF ELECTRONIC PACKAGING, 2012, 卷号: 134, 期号: 4, 页码: 041003
作者:  Yan, Yi;  Chen, Xu;  Liu, Xingsheng;  Mei, Yunhui;  Lu, Guo-Quan
Adobe PDF(1975Kb)  |  收藏  |  浏览/下载：241/0  |  提交时间：2013/10/11
Nanosilver Paste  Laser Diodes  Die Bonding