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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：228/2  |  提交时间：2017/06/08
Reconfigurable microwave photonic differentiator based on an integrated Kerr frequency comb source 会议论文
2017 Opto-Electronics and Communications Conference, OECC 2017 and Photonics Global Conference, PGC 2017, Singapore, Singapore, 2017-07-31
作者:  Xu, Xingyuan;  Wu, Jiayang;  Shoeiby, Mehrdad;  Nguyen, Thach G.;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.
Adobe PDF(602Kb)  |  收藏  |  浏览/下载：160/0  |  提交时间：2018/06/25
Design of high precision temperature control system for to packaged LD 会议论文
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, Beijing, China, 2017-06-04
作者:  Liang, Enji;  Luo, Baoke;  Zhuang, Bin;  He, Zhengquan;  He, Zhengquan (lajihuya@163.com)
Adobe PDF(324Kb)  |  收藏  |  浏览/下载：255/2  |  提交时间：2018/02/11
High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：399/2  |  提交时间：2017/07/06
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：213/1  |  提交时间：2017/05/27
Integrated Kerr comb-based reconfigurable transversal differentiator for microwave photonic signal processing（SPIE） 会议论文
NANOPHOTONICS AUSTRALASIA 2017, Melbourne, AUSTRALIA, 2017-12-10
作者:  Xu, Xingyuan;  Wu, Jiayang;  Shoeiby, Mehrdad;  Nguyen, Thach G.;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.;  Moss, DJ (reprint author), Swinburne Univ Technol, Ctr Microphoton, Hawthorn, Vic 3122, Australia.
Adobe PDF(900Kb)  |  收藏  |  浏览/下载：223/1  |  提交时间：2018/03/28
Optical Frequency Combs  Micro-ring Resonator  Optical Signal Processing  
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：271/2  |  提交时间：2017/06/08
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载：232/1  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：278/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：248/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes