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Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long;  Yang, Yingkun;  Mei, Yunhui (yunhui@tju.edu.cn)
Adobe PDF(1037Kb)  |  收藏  |  浏览/下载：235/1  |  提交时间：2017/07/18
Research Progress on Femtosecond Laser Drilling of Cooling Holes in Aeroengines 会议论文
PROCEEDINGS OF THE 2016 INTERNATIONAL FORUM ON MECHANICAL, CONTROL AND AUTOMATION (IFMCA 2016), Shenzhen, PEOPLES R CHINA, 2016-12-30
作者:  Hou, Xueqin;  Zhang, Zheng;  Liu, Xinling;  Yang, Yong;  Hou, XQ (reprint author), Beijing Inst Aeronaut Mat, AVIC Failure Anal Ctr, Beijing 100095, Peoples R China.
Adobe PDF(3181Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2018/01/03
Femtosecond Laser  Drilling  Cooling Hole  Aeroengine  Research State  Challenge  
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：195/1  |  提交时间：2017/05/27
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：258/2  |  提交时间：2017/06/08
Growth of SiC nanowires by low pressure chemical vapor infiltration using different catalysts 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2016, 卷号: 36, 期号: 15, 页码: 3615-3625
作者:  Men, Jing;  Liu, Yongsheng;  Luo, Rong;  Li, Weinan;  Cheng, Laifei;  Zhang, Litong;  Liu, Yongsheng (yongshengliu@nwpu.edu.cn)
Adobe PDF(4521Kb)  |  收藏  |  浏览/下载：302/3  |  提交时间：2016/10/14
Sic Nanowires  Vapor-liquid-solid (Vls)  Low Pressure Chemical Vapor Infiltration (Lpcvi)  2d C/sic Composites  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：391/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：292/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
The Impact of Fabrication Errors of Double-layer BOE on Diffraction Efficiency 会议论文
8TH INTERNATIONAL SYMPOSIUM ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: DESIGN, MANUFACTURING, AND TESTING OF MICRO- AND NANO-OPTICAL DEVICES AND SYSTEMS; AND SMART STRUCTURES AND MATERIALS, Suzhou, PEOPLES R CHINA, 2016-04-26
作者:  Ma Zebin;  Kang Fuzeng;  Wang Hao;  Ma, ZB (reprint author), Chinese Acad Sci, Xian Inst Opt & Precis Mech, State Key Lab Transient Opt & Photon, Xian, Peoples R China.
Adobe PDF(329Kb)  |  收藏  |  浏览/下载：212/0  |  提交时间：2016/12/02
Diffractive Optical Element  Double-layer Boe  Diffraction Efficiency  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：182/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power