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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：229/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：228/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Incoherent Dark Solitons Splitting in LiNbO3:Fe Crystal 期刊论文
Proceedings of SPIE - The International Society for Optical Engineering, 2010, 卷号: 7846
作者:  Zhang YH(Zhang Yuhong);  Lu Keqing(卢克清);  Long XW(Long Xuewen);  Li KH(Li Kehao);  Guo JB(Guo Jianbang)
Adobe PDF(619Kb)  |  收藏  |  浏览/下载：350/1  |  提交时间：2011/07/08