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High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology 会议论文
Novel In-Plane Semiconductor Lasers XVI, San Francisco, CA, United states, 2017-01-30
作者:  Yu, Dongshan;  Liang, Xuejie;  Wang, Jingwei;  Li, Xiaoning;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(667Kb)  |  收藏  |  浏览/下载：346/2  |  提交时间：2017/07/06
Growth of SiC nanowires by low pressure chemical vapor infiltration using different catalysts 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2016, 卷号: 36, 期号: 15, 页码: 3615-3625
作者:  Men, Jing;  Liu, Yongsheng;  Luo, Rong;  Li, Weinan;  Cheng, Laifei;  Zhang, Litong;  Liu, Yongsheng (yongshengliu@nwpu.edu.cn)
Adobe PDF(4521Kb)  |  收藏  |  浏览/下载：295/3  |  提交时间：2016/10/14
Sic Nanowires  Vapor-liquid-solid (Vls)  Low Pressure Chemical Vapor Infiltration (Lpcvi)  2d C/sic Composites  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：243/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress