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Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：243/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：221/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：374/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：281/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：214/0  |  提交时间：2015/12/04
Study of the key aspects in developing kW-level diode lasers for solid state laser pumping 会议论文
Proceedings - 2014 International Conference Laser Optics, LO 2014, St. Petersburg, Russia, 2014-06-30
作者:  Li, Xiaoning;  Wang, Jingwei;  Cai, Wanshao;  Hao, Bei;  Hou, Dong;  Liu, Hui;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(249Kb)  |  收藏  |  浏览/下载：254/2  |  提交时间：2015/03/31
Hard solder 20kW QCW Stack Array Diode Laser 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Xiaoning Li;  Lijun Kang;  Jingwei Wang;  Pu Zhang;  Lingling Xiong;  Xingsheng Liu
Adobe PDF(1026Kb)  |  收藏  |  浏览/下载：697/3  |  提交时间：2013/01/16
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
High-Power Diode Laser Technology and Applications X, San Francisco, CA, United states, January 22, 2012 - January 24, 2012
作者:  Wang, Jingwei;  Kang, Lijun;  Zhang, Pu;  Nie, Zhiqiang;  Li, Xiaoning;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(2099Kb)  |  收藏  |  浏览/下载：519/1  |  提交时间：2013/03/08