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Research on 940nm kilowatt high efficiency quasi-continuous diode laser bars 会议论文
14th National Conference on Laser Technology and Optoelectronics, LTO 2019, Shanghai, China, 2019-03-17
作者:  Zhao, Yuliang;  Wang, Zhenfu;  Yang, Guowen;  Li, Te;  Song, Yunfei;  Qi, Luhan;  Wang, Gang;  Liu, Yuxian;  Li, Bo;  Bai, Shaobo
Adobe PDF(376Kb)  |  收藏  |  浏览/下载：171/2  |  提交时间：2019/08/14
laser diodes  structure design  high-power  high efficiency  
High power, high efficiency continuous-wave 808 nm laser diode arrays 期刊论文
OPTICS AND LASER TECHNOLOGY, 2017, 卷号: 97, 页码: 297-301
作者:  Wang, Zhenfu;  Li, Te;  Yang, Guowen;  Song, Yunfei;  Yang, Guowen (yangguowen@opt.ac.cn)
Adobe PDF(1171Kb)  |  收藏  |  浏览/下载：247/1  |  提交时间：2017/09/07
Laser Diode Array  Power Conversion Efficiency  Power  Loss  
Development of 808 nm Quasi-Continuous Wave Laser Diode Bar with 600 W Output Power 期刊论文
Zhongguo Jiguang/Chinese Journal of Lasers, 2017, 卷号: 44, 期号: 6
作者:  Wang, Zhenfu;  Li, Te;  Yang, Guowen;  Song, Yunfei;  Yang, Guowen (yangguowen@opt.ac.cn)
Adobe PDF(4290Kb)  |  收藏  |  浏览/下载：198/1  |  提交时间：2017/09/07
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：365/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：279/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature