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Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror 会议论文
Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, Kunming, China, 2021-12-07
作者:  Zheng, Xiang-Ke;  Kang, Shi-Fa;  Wang, Peng;  Li, Hua;  Shu, Lin-Sen
Adobe PDF(1238Kb)  |  收藏  |  浏览/下载：116/1  |  提交时间：2022/04/27
Plane mirror  Finite element model  micro-stress  Assembly process  Surface-shape  Experiment