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Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror
Zheng, Xiang-Ke1; Kang, Shi-Fa1; Wang, Peng1; Li, Hua1; Shu, Lin-Sen2
2022
会议名称8th Symposium on Novel Photoelectronic Detection Technology and Applications
会议录名称Eighth Symposium on Novel Photoelectronic Detection Technology and Applications
卷号12169
会议日期2021-12-07
会议地点Kunming, China
出版者SPIE
产权排序1
摘要

In order to quickly obtain the effect of different bonding process on the surface-shape of the adhesive bonded mirror, the simulation and experimental study of the linear expansion micro-stress assembly process were carried out.The mathematical expression of the solidification micro-stress of the adhesive in plane mirror assembly is derived based on the volume shrinkage rate. The structural stiffness of the mirror and the frame is also taken into the mathematical expression of the micro-stress.A finite element model named "Mirror-Adhesive -Frame" was developed using ANSYS Parametric Design Language (APDL) and User Interface Design Language (UIDL) to calculate the PV and RMS values of the surface-shape of the mirror after bonding.The ZYGO interferometer is used to measure the PV and RMS values of the surface-shape index before and after the bonding of the mirror with a specification of ?100mm-15mm. By comparing the experimental results and the simulation results, the correction value of the equivalent linear expansion parameter of the adhesive layer is obtained. Then, the corrected equivalent linear expansion coefficient of the adhesive layer is brought into the simulation model to predict the PV and RMS values. The results show that the prediction results of the developed simulation model are in good agreement with the measurement results. Moreover, it is found that when the circumference and back of the mirror are both bonded, the PV and RMS values of the surface-shape reach the maximum, and the PV and RMS values are 0.187? and 0.044?, respectively. © 2022 SPIE

关键词Plane mirror Finite element model micro-stress Assembly process Surface-shape Experiment
作者部门装校技术研究中心
DOI10.1117/12.2623637
收录类别EI
ISBN号9781510653115
语种英语
ISSN号0277786X;1996756X
EI入藏号20221611967855
引用统计
文献类型会议论文
条目标识符http://ir.opt.ac.cn/handle/181661/95831
专题装校技术研究中心
通讯作者Zheng, Xiang-Ke
作者单位1.Xi'an institute of optices and precision mechanics of cas, Xi'an; 710119, China;
2.School of Mechanical Engineering, Shaanxi University of technology, Hanzhong; 723001, China
推荐引用方式
GB/T 7714
Zheng, Xiang-Ke,Kang, Shi-Fa,Wang, Peng,et al. Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror[C]:SPIE,2022.
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