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Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：204/2  |  提交时间：2017/06/08
The cooling control system for focal plane assembly of astronomical satellite camera based on TEC 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Yuqing, He;  Yunfei, Du;  Wei, Gao;  Baopeng, Li;  Xuewu, Fan;  Wengang, Yang
Adobe PDF(401Kb)  |  收藏  |  浏览/下载：200/2  |  提交时间：2017/05/15
Design of high precision temperature control system for to packaged LD 会议论文
AOPC 2017: 3D Measurement Technology for Intelligent Manufacturing, Beijing, China, 2017-06-04
作者:  Liang, Enji;  Luo, Baoke;  Zhuang, Bin;  He, Zhengquan;  He, Zhengquan (lajihuya@163.com)
Adobe PDF(324Kb)  |  收藏  |  浏览/下载：216/2  |  提交时间：2018/02/11
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：218/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
A Review of Large Aperture Schlieren Photography Technique 会议论文
SELECTED PAPERS OF THE PHOTOELECTRONIC TECHNOLOGY COMMITTEE CONFERENCES HELD NOVEMBER 2015, PEOPLES R CHINA, 2016-11-15
作者:  Xu Song-bo;  Xie Yong-jun;  Chen Lei;  Xu, SB (reprint author), Xian Inst Opt & Precis Mech CA, Xian 710119, Peoples R China.
Adobe PDF(2245Kb)  |  收藏  |  浏览/下载：240/3  |  提交时间：2016/10/18
Schlieren  Large Aperture Primary Mirror  Image Stabilization  
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(624Kb)  |  收藏  |  浏览/下载：193/1  |  提交时间：2015/12/04
Design and Verification of Focal Plane Assembly Thermal Control System of One Space-based Astronomy Telescope 会议论文
AOPC 2015: TELESCOPE AND SPACE OPTICAL INSTRUMENTATION, Beijing, PEOPLES R CHINA, 2015-05-05
作者:  Yang Wen-gang;  Fan Xue-wu;  Wang Chen-jie;  Wang Ying-hao;  Feng Liang-jie;  Du Yun-fei;  Ren Guo-rui;  Wang Wei;  Li Chuang;  Gao Wei
Adobe PDF(325Kb)  |  收藏  |  浏览/下载：209/1  |  提交时间：2015/12/04
Colorimetric pyrometry system design and calibration experiment 会议论文
INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING (ICPOE 2014), Xian, PEOPLES R CHINA, 2014-10-13
作者:  Chen Yaohong;  Liu Wei;  Fan Zheyuan;  Ren Long;  Yi Bo;  Xie Qingsheng;  Duan Chengpeng
Adobe PDF(443Kb)  |  收藏  |  浏览/下载：258/0  |  提交时间：2015/12/04