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Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Spectroscopic properties and Judd-Ofelt analysis of Dy3+-doped and Dy3+, Tm3+-codped Ge-In-S chalcogenide glasses 期刊论文
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2013, 卷号: 377, 期号: S1, 页码: 95-99
作者:  Guo, Haitao;  Xu, Yantao;  Chen, Hongyan;  Cui, Xiaoxia;  Qiao, Zebang;  Gu, Shaoxuan;  Hou, Chaoqi;  Meng, Wei;  Lu, Chunfeng;  Peng, Bo
Adobe PDF(504Kb)  |  收藏  |  浏览/下载：432/1  |  提交时间：2014/01/10
Chalcogenide Glass  Rare-earth Ions  Spectroscopy  Mid-infrared  Judd-ofelt