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High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载:255/2  |  提交时间:2018/04/25
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载:188/1  |  提交时间:2017/05/27
Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wang, Jingwei;  Zhu, Pengfei;  Liu, Hui;  Liang, Xuejie;  Wu, Dihai;  Liu, Yalong;  Yu, Dongshan;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(594Kb)  |  收藏  |  浏览/下载:207/1  |  提交时间:2017/06/08
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载:170/1  |  提交时间:2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载:220/0  |  提交时间:2015/12/04
Packaging of Complete Indium-free High Reliable and High Power Diode Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Wang, Jingwei;  Li, Xiaoning;  Feng, Feifei;  Liu, Yalong;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(476Kb)  |  收藏  |  浏览/下载:178/0  |  提交时间:2015/12/04
Hard solder 20kW QCW Stack Array Diode Laser 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Xiaoning Li;  Lijun Kang;  Jingwei Wang;  Pu Zhang;  Lingling Xiong;  Xingsheng Liu
Adobe PDF(1026Kb)  |  收藏  |  浏览/下载:696/3  |  提交时间:2013/01/16
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
High-Power Diode Laser Technology and Applications X, San Francisco, CA, United states, January 22, 2012 - January 24, 2012
作者:  Wang, Jingwei;  Kang, Lijun;  Zhang, Pu;  Nie, Zhiqiang;  Li, Xiaoning;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(2099Kb)  |  收藏  |  浏览/下载:516/1  |  提交时间:2013/03/08