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Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：374/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：281/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Low-penalty up to 16-QAM wavelength conversion in a low loss CMOS compatible spiral waveguide 会议论文
2016 Optical Fiber Communications Conference and Exhibition, OFC 2016, Anaheim, CA, United states, 2016-03-20
作者:  Da Ros, Francesco;  Porto Da Silva, Edson;  Zibar, Darko;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Galili, Michael;  Moss, David J.;  Oxenlewe, Leif K.
Adobe PDF(858Kb)  |  收藏  |  浏览/下载：124/0  |  提交时间：2016/09/26
Microwave and RF Applications for Micro-resonator based Frequency Combs 会议论文
INTEGRATED OPTICS: DEVICES, MATERIALS, AND TECHNOLOGIES XX, San Francisco, CA, 2016-02-15
作者:  Nguyen, Thach G.;  Shoeiby, Mehrdad;  Ferrera, Marcello;  Pasquazi, Alessia;  Peccianti, Marco;  Chu, Sai T.;  Little, Brent E.;  Morandotti, Roberto;  Mitchell, Arnan;  Moss, David J.;  Nguyen, TG (reprint author), RMIT Univ, Schoof Elect & Comp Engn, Melbourne, Vic 3001, Australia.
Adobe PDF(716Kb)  |  收藏  |  浏览/下载：169/0  |  提交时间：2016/10/18
Component  Cmos Silicon Photonics  Integrated Optics  Integrated Optics Nonlinear  Integrated Optics Materials  
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning;  Liu, Xingsheng;  Hou, D (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian, Shaanxi, Peoples R China.
Adobe PDF(772Kb)  |  收藏  |  浏览/下载：217/1  |  提交时间：2016/10/18
Horizontal Array  Hard Solder  Spetrum Control  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：171/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power