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A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：278/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：170/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：211/2  |  提交时间：2015/12/04