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Calibration Mechanism Design and Stiffness Analysis 会议论文
2019 4th International Conference on Mechanical, Manufacturing, Modeling and Mechatronics, IC4M 2019 and 2019 4th International Conference on Design Engineering and Science, ICDES 2019, Nice, France, 2019-02-22
作者:  Xia, Siyu;  Shi, Jinfeng;  Ren, Guorui;  Li, Chuang
Adobe PDF(1115Kb)  |  收藏  |  浏览/下载：179/1  |  提交时间：2019/06/26
Research on 940nm kilowatt high efficiency quasi-continuous diode laser bars 会议论文
14th National Conference on Laser Technology and Optoelectronics, LTO 2019, Shanghai, China, 2019-03-17
作者:  Zhao, Yuliang;  Wang, Zhenfu;  Yang, Guowen;  Li, Te;  Song, Yunfei;  Qi, Luhan;  Wang, Gang;  Liu, Yuxian;  Li, Bo;  Bai, Shaobo
Adobe PDF(376Kb)  |  收藏  |  浏览/下载：172/2  |  提交时间：2019/08/14
laser diodes  structure design  high-power  high efficiency  
Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：479/2  |  提交时间：2018/04/25
A method of designing water-cooled horizontal array diode lasers for uniform junction temperature 会议论文
Semiconductor Lasers and Applications VIII, Beijing, China, 2018-10-12
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1465Kb)  |  收藏  |  浏览/下载：104/0  |  提交时间：2019/03/07
Ultra-short wavelength operation in Thulium-doped silica fiber laser with bidirectional pumping 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Xiao, Xusheng;  Guo, Haitao;  Yan, Zhijun;  Wang, Hushan;  Xu, Yantao;  Lu, Min;  Wang, Yishan;  Peng, Bo
Adobe PDF(535Kb)  |  收藏  |  浏览/下载：192/2  |  提交时间：2017/05/15
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：221/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：372/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
Diode-pumped Yb:YAG thin disk laser with a novel multi-pass pump and cooling arrangement 会议论文
Applied Mechanics and Materials, 2013
作者:  Song Qiong Ge;  Cheng Guang Hua;  Zhu Jiang Feng;  Hui Y(会议)
Adobe PDF(384Kb)  |  收藏  |  浏览/下载：367/0  |  提交时间：2014/09/17
3000W CW diode laser cladding system 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Lingling Xiong;  Min Wang;  Xiaobiao Wang;  Yanfang Zheng;  Di Wu;  Pu Zhang;  Xiaoning Li;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(7498Kb)  |  收藏  |  浏览/下载：570/1  |  提交时间：2013/01/16
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Zhiyong Zhang;  Pu Zhang;  Xiaoning Li;  Lingling Xiong;  Hui Liu;  Zhiqiang Nie;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(1758Kb)  |  收藏  |  浏览/下载：386/0  |  提交时间：2013/06/26