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Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：426/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
Influence of temperature on “Smile” in high power diode laser bars 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2016, 卷号: 45, 期号: 5
作者:  Wang, Shu-Na;  Zhang, Pu;  Xiong, Ling-Ling;  Nie, Zhi-Qiang;  Wu, Di-Hai;  Liu, Xing-Sheng
Adobe PDF(568Kb)  |  收藏  |  浏览/下载：269/2  |  提交时间：2016/10/14
Diodes  Heat Sinks  Lasers  Power Semiconductor Diodes  Semiconductor Lasers  Temperature  Thermal Stress