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Design of Underwater Wireless Optical Communication and Radar Integrated System 会议论文
AOPC 2022: Atmospheric and Environmental Optics, Virtual, Online, China, 2022-12-18
作者:  Li, Peng;  Yang, Haodong;  Wang, Shanglin;  Tu, Min;  Yan, Qiurong;  Han, Xiaotian;  Nie, Wenchao;  Chang, Chang;  Liao, Peixuan;  Wang, Wei
Adobe PDF(887Kb)  |  收藏  |  浏览/下载：121/2  |  提交时间：2023/03/02
communication and radar integration  high reliability communication  high precision radar imaging  
A Data Mining Algorithm for Hyperspectral Target Detection Based on UAV 会议论文
Proceedings of 2021 International Conference on Autonomous Unmanned Systems, ICAUS 2021, Changsha, China, 2021-09-24
作者:  Zhou, Jian;  Qiu, Shi;  Wang, Zhuping;  Nie, Cong
Adobe PDF(3415Kb)  |  收藏  |  浏览/下载：100/0  |  提交时间：2022/07/01
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：147/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：256/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：255/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：228/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：390/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：291/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS II, San Francisco, CA, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng;  Li, XN (reprint author), Focuslight Technol Inc, 56 Zhangba 6th Rd, Xian 710077, Shaanxi, Peoples R China.
Adobe PDF(651Kb)  |  收藏  |  浏览/下载：180/1  |  提交时间：2016/10/18
Diode Laser  Mcc  Hard Solder  High Power  
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：221/2  |  提交时间：2015/12/04