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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：33/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：251/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
Thermal Stress and Smile of Conduction-cooled High Power Semiconductor Laser Arrays 期刊论文
Guangzi Xuebao/Acta Photonica Sinica, 2017, 卷号: 46, 期号: 9
作者:  Lu, Yao;  Nie, Zhi-Qiang;  Chen, Tian-Qi;  Zhang, Pu;  Xiong, Ling-Ling;  Wu, Di-Hai;  Li, Xiao-Ning;  Wang, Zhen-Fu;  Liu, Xing-Sheng;  Nie, Zhi-Qiang (niezq@opt.ac.cn)
Unknown(4848Kb)  |  收藏  |  浏览/下载：200/2  |  提交时间：2017/12/30