中文版 | English

在结果中检索

OPT OpenIR

浏览/检索结果: 共18条，第1-10条 帮助

限定条件                    
已选(0)清除 条数/页：   排序方式：
A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：101/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
User-friendly, reconfigurable all-optical signal processing with integrated photonics 会议论文
2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting, AT-AP-RASC 2022, Gran Canaria, Spain, 2022-05-30
作者:  Fischer, Bennet;  Chemnitz, Mario;  Wetzel, Benjamin;  Roztocki, Piotr;  MacLellan, Benjamin;  Reimer, Christian;  Little, Brent;  Chu, Sai;  Viktorov, Evgeny;  Moss, David;  Kues, Michael;  Azana, Jose;  Pasquazi, Alessia;  Peccianti, Marco;  Morandotti, Roberto
Adobe PDF(1409Kb)  |  收藏  |  浏览/下载：98/0  |  提交时间：2022/08/31
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：135/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：144/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
High-Power Diode Laser Technology XVII, San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：149/2  |  提交时间：2019/07/08
Thermal stress  laser diode array  SMILE effect  spectrum  
Lateral thermal dissipation of InP-based InGaAsP ridge waveguide laser 会议论文
Semiconductor Lasers and Applications VIII, Beijing, China, 2018-10-12
作者:  Li, Xiao;  Qiu, Bocang;  Ruiying, Zhang;  Yue, Zhao
Adobe PDF(623Kb)  |  收藏  |  浏览/下载：131/0  |  提交时间：2019/03/12
A method of designing water-cooled horizontal array diode lasers for uniform junction temperature 会议论文
Semiconductor Lasers and Applications VIII, Beijing, China, 2018-10-12
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1465Kb)  |  收藏  |  浏览/下载：108/0  |  提交时间：2019/03/07
Thermal characteristics of compact conduction-cooled high power diode laser array packages 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Zhang, Pu;  Liu, Xingsheng;  Zhu, Qiwen;  Wang, Jingwei
Adobe PDF(768Kb)  |  收藏  |  浏览/下载：210/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：252/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：387/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties