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A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：104/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：177/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long;  Yang, Yingkun;  Mei, Yunhui (yunhui@tju.edu.cn)
Adobe PDF(1037Kb)  |  收藏  |  浏览/下载：235/1  |  提交时间：2017/07/18
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：258/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：256/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：391/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties  
Effects of Packaging on the Performances of High Brightness 9xx nm CW Mini-bar Diode Lasers 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Li, Xiaoning;  Wang, Jingwei;  Feng, Feifei;  Liu, Yalong;  Yu, Dongshan;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(515Kb)  |  收藏  |  浏览/下载：249/1  |  提交时间：2015/12/04
Effect of Interface Layer on the Performance of High Power Diode Laser Arrays 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Zhang, Pu;  Wang, Jingwei;  Xiong, Lingling;  Li, Xiaoning;  Hou, Dong;  Liu, Xingsheng
Adobe PDF(624Kb)  |  收藏  |  浏览/下载：212/1  |  提交时间：2015/12/04
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Hou, Dong;  Wang, Jingwei;  Zhang, Pu;  Cai, Lei;  Dai, Ye;  Li, Yingjie;  Liu, Xingsheng
Adobe PDF(1264Kb)  |  收藏  |  浏览/下载：225/0  |  提交时间：2015/12/04
A 3000W 808nm QCW G-Stack Semiconductor Laser Array 会议论文
XX INTERNATIONAL SYMPOSIUM ON HIGH-POWER LASER SYSTEMS AND APPLICATIONS 2014, Chengdu, PEOPLES R CHINA, 2014-08-25
作者:  Zhang, Pu;  Wang, Jingwei;  Hou, Dong;  Wang, Zhenfu;  Xiong, Ling Ling;  Liu, Hui;  Nie, Zhiqiang;  Liu, Xingsheng
Adobe PDF(355Kb)  |  收藏  |  浏览/下载：221/2  |  提交时间：2015/12/04