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Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：40/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode  
Fatigue mechanism analysis and life prediction model of piezoelectric ceramic tube based on fiber-optic nutator 会议论文
Fifth International Conference on Optoelectronic Science and Materials, ICOSM 2023, Hefei, China, 2023-09-22
作者:  Peng, Bo;  Ruan, Ping;  Han, Junfeng;  Chang, Zhiyuan;  Han, Jingyu;  Wang, Jiahao;  He, Deqiu
Adobe PDF(877Kb)  |  收藏  |  浏览/下载：45/0  |  提交时间：2024/03/19