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Enhanced Adhesion of Copper Films on Fused Silica Glass Substrate by Plasma Pre-Treatment 期刊论文
MATERIALS, 2023, 卷号: 16, 期号: 14
作者:  Yang, Liqing;  Yang, Xianli;  Gao, Fei;  Guan, Yongmao;  Wan, Rui;  Wang, Pengfei
Adobe PDF(5539Kb)  |  收藏  |  浏览/下载：80/2  |  提交时间：2023/08/18
copper films  plasma pre-treatment  adhesion  diffusion junction layer  
Microstructural and luminescence characteristics of high-linearity ZnS:Cu2+,Cl− phosphor 期刊论文
Journal of Materials Science: Materials in Electronics, 2023, 卷号: 34, 期号: 5
作者:  Xing, Xue;  Cao, Weiwei;  Wu, Zhaoxin;  Bai, Xiaohong;  Gao, Jiarui;  Liang, Xiaozhen;  Wang, Bo;  Wang, Chao;  Xiang, Junjie;  Shi, Dalian;  Lv, Linwei;  Bai, Yonglin
Adobe PDF(2485Kb)  |  收藏  |  浏览/下载：115/0  |  提交时间：2023/02/28
Microstructural and luminescence characteristics of high-linearity ZnS:Cu2+,Cl- phosphor 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 5
作者:  Xing, Xue;  Cao, Weiwei;  Wu, Zhaoxin;  Bai, Xiaohong;  Gao, Jiarui;  Liang, Xiaozhen;  Wang, Bo;  Wang, Chao;  Xiang, Junjie;  Shi, Dalian;  Lv, Linwei;  Bai, Yonglin
Adobe PDF(2485Kb)  |  收藏  |  浏览/下载：90/0  |  提交时间：2023/08/14