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Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror 会议论文
Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, Kunming, China, 2021-12-07
作者:  Zheng, Xiang-Ke;  Kang, Shi-Fa;  Wang, Peng;  Li, Hua;  Shu, Lin-Sen
Adobe PDF(1238Kb)  |  收藏  |  浏览/下载：126/1  |  提交时间：2022/04/27
Plane mirror  Finite element model  micro-stress  Assembly process  Surface-shape  Experiment  
A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：98/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
User-friendly, reconfigurable all-optical signal processing with integrated photonics 会议论文
2022 3rd URSI Atlantic and Asia Pacific Radio Science Meeting, AT-AP-RASC 2022, Gran Canaria, Spain, 2022-05-30
作者:  Fischer, Bennet;  Chemnitz, Mario;  Wetzel, Benjamin;  Roztocki, Piotr;  MacLellan, Benjamin;  Reimer, Christian;  Little, Brent;  Chu, Sai;  Viktorov, Evgeny;  Moss, David;  Kues, Michael;  Azana, Jose;  Pasquazi, Alessia;  Peccianti, Marco;  Morandotti, Roberto
Adobe PDF(1409Kb)  |  收藏  |  浏览/下载：96/0  |  提交时间：2022/08/31