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Feasible spindle speed interval identification method for large aeronautical component robotic milling system 期刊论文
Mechatronics, 2024, 卷号: 99
作者:  Wang, Zhanxi;  Zhang, Banghai;  Gao, Wei;  Qin, Xiansheng;  Zhang, Yicha;  Zheng, Chen
Adobe PDF(17496Kb)  |  收藏  |  浏览/下载：51/0  |  提交时间：2024/03/22
Large aeronautical component  Milling stability  Dynamic characteristics  Join-assembly  Robotic milling  
Bi2O2S topological transformation and in-situ regrowth of [hk1]-oriented SbBiS3-xSex 2D skeleton structure for construction of efficient quasi-two-dimensional Sb2S3-xSex-based heterojunction photoanodes 期刊论文
SEPARATION AND PURIFICATION TECHNOLOGY, 2024, 卷号: 334
作者:  Zhang, Liyuan;  Liu, Xinyang;  Liu, Dekang;  Cheng, Yufei;  Li, Qiujie;  Wang, Yishan;  Hu, Xiaoyun;  Miao, Hui
Adobe PDF(7051Kb)  |  收藏  |  浏览/下载：60/0  |  提交时间：2024/02/23
Quasi-two-dimensional heterojunction  SbBiS3-xSex  2D skeleton structure  [hk1] preferred orientation  Photoelectrochemical performance  
Room-temperature MoTe2/InSb heterostructure large-area terahertz detector 期刊论文
Infrared Physics and Technology, 2024, 卷号: 137
作者:  Wang, Jiatong;  Zhang, Min;  Zhou, Zhiwen;  Li, Ling;  Song, Qi;  Yan, Peiguang
Adobe PDF(2464Kb)  |  收藏  |  浏览/下载：44/1  |  提交时间：2024/03/13
Terahertz detector  Heterostructure  Interdigital electrodes  
Constructing 1D/0D Sb2S3/Cd0.6Zn0.4S S-scheme heterojunction by vapor transport deposition and in-situ hydrothermal strategy towards photoelectrochemical water splitting 期刊论文
Journal of Alloys and Compounds, 2024, 卷号: 975
作者:  Liu, Dekang;  Jin, Wei;  Zhang, Liyuan;  Li, Qiujie;  Sun, Qian;  Wang, Yishan;  Hu, Xiaoyun;  Miao, Hui
Adobe PDF(6121Kb)  |  收藏  |  浏览/下载：61/0  |  提交时间：2024/01/03
Sb2S3  Vapor transport deposition  S-scheme heterojunction  Photoelectrochemical water splitting  
Research on the Effect of Vibrational Micro-Displacement of an Astronomical Camera on Detector Imaging 期刊论文
SENSORS, 2024, 卷号: 24, 期号: 3
作者:  Liu, Bin;  Guan, Shouxin;  Wang, Feicheng;  Zhang, Xiaoming;  Yu, Tao;  Wei, Ruyi
Adobe PDF(3036Kb)  |  收藏  |  浏览/下载：60/0  |  提交时间：2024/03/15
vibration  resonance  displacement  cooling  cameras  
Interface Contact Thermal Resistance of Die Attach in High-Power Laser Diode Packages 期刊论文
ELECTRONICS, 2024, 卷号: 13, 期号: 1
作者:  Deng, Liting;  Li, Te;  Wang, Zhenfu;  Zhang, Pu;  Wu, Shunhua;  Liu, Jiachen;  Zhang, Junyue;  Chen, Lang;  Zhang, Jiachen;  Huang, Weizhou;  Zhang, Rui
Adobe PDF(6228Kb)  |  收藏  |  浏览/下载：40/0  |  提交时间：2024/02/23
die attach  interface contact thermal resistance  thermal management  transient thermal analysis  structure function  high-power laser diode