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Packaging IGBT modules by rapid sintering of nanosilver paste in a current way 会议论文
2017 International Conference on Electronics Packaging, ICEP 2017, Tendo, Yamagata, Japan, 2017-04-19
作者:  Xie, Yijing;  Mei, Yunhui;  Feng, Shuangtao;  Zhang, Pu;  Zhang, Long;  Yang, Yingkun;  Mei, Yunhui (yunhui@tju.edu.cn)
Adobe PDF(1037Kb)  |  收藏  |  浏览/下载：232/1  |  提交时间：2017/07/18
The cooling control system for focal plane assembly of astronomical satellite camera based on TEC 会议论文
Second International Conference on Photonics and Optical Engineering, Xi'an, China, 2016-10-14
作者:  Yuqing, He;  Yunfei, Du;  Wei, Gao;  Baopeng, Li;  Xuewu, Fan;  Wengang, Yang
Adobe PDF(401Kb)  |  收藏  |  浏览/下载：209/2  |  提交时间：2017/05/15
Thermal effects of optical antenna under the irradiation of laser 会议论文
AOPC 2017: Space Optics and Earth Imaging and Space Navigation, Beijing, China, 2017-06-04
作者:  Sun, Yi;  Li, Fu;  Yang, Wenqiang;  Yang, Jianfeng
Adobe PDF(931Kb)  |  收藏  |  浏览/下载：241/0  |  提交时间：2018/02/11
Research Progress on Femtosecond Laser Drilling of Cooling Holes in Aeroengines 会议论文
PROCEEDINGS OF THE 2016 INTERNATIONAL FORUM ON MECHANICAL, CONTROL AND AUTOMATION (IFMCA 2016), Shenzhen, PEOPLES R CHINA, 2016-12-30
作者:  Hou, Xueqin;  Zhang, Zheng;  Liu, Xinling;  Yang, Yong;  Hou, XQ (reprint author), Beijing Inst Aeronaut Mat, AVIC Failure Anal Ctr, Beijing 100095, Peoples R China.
Adobe PDF(3181Kb)  |  收藏  |  浏览/下载：255/1  |  提交时间：2018/01/03
Femtosecond Laser  Drilling  Cooling Hole  Aeroengine  Research State  Challenge  
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：193/1  |  提交时间：2017/05/27
Plasma assisted fabrication of multi-layer graphene/nickel hybrid film as enhanced micro-supercapacitor electrodes 会议论文
17th IUMRS International Conference in Asia, IUMRS-ICA 2016, Qingdao, China, 2016-10-20
作者:  Ding, Q.;  Li, W.L.;  Zhao, W.L.;  Wang, J.Y.;  Xing, Y.P.;  Li, X.;  Xue, T.;  Qi, W.;  Zhang, K.L.;  Yang, Z.C.;  Zhao, J.S.
Adobe PDF(4571Kb)  |  收藏  |  浏览/下载：249/1  |  提交时间：2017/04/26
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：254/2  |  提交时间：2017/06/08
Growth of SiC nanowires by low pressure chemical vapor infiltration using different catalysts 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2016, 卷号: 36, 期号: 15, 页码: 3615-3625
作者:  Men, Jing;  Liu, Yongsheng;  Luo, Rong;  Li, Weinan;  Cheng, Laifei;  Zhang, Litong;  Liu, Yongsheng (yongshengliu@nwpu.edu.cn)
Adobe PDF(4521Kb)  |  收藏  |  浏览/下载：300/3  |  提交时间：2016/10/14
Sic Nanowires  Vapor-liquid-solid (Vls)  Low Pressure Chemical Vapor Infiltration (Lpcvi)  2d C/sic Composites  
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：252/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
Thermal behavior of microchannel cooled high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Zhu, Qiwen;  Lu, Yao;  Dang, Yifan;  Liu, Xingsheng
Adobe PDF(2211Kb)  |  收藏  |  浏览/下载：387/2  |  提交时间：2016/11/22
Computational Fluid Dynamics  Copper  Crosstalk  Diodes  Electronics Packaging  Finite Element Method  Flow Of Water  Heat Resistance  Heat Sinks  Hydraulics  Laser Beam Welding  Microchannels  Numerical Methods  Optical Properties  Power Semiconductor Diodes  Reliability  Thermodynamic Properties