OPT OpenIR  > 瞬态光学技术国家重点实验室
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays
Nie, Zhiqiang1; Lu, Yao1,2; Chen, Tianqi1,2; Zhang, Pu1; Wu, Dihai1,2; Wang, Mingpei1,2; Xiong, Lingling1; Li, Xiaoning3; Wang, Zhenfu1; Liu, Xingsheng1,2,3; Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
作者部门瞬态光学技术国家重点实验室
2018-05-01
发表期刊IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
ISSN2156-3950
卷号8期号:5页码:818-829
产权排序1
摘要Thermomechanical behavior has an important effect on reliability and lifetime of high-power diode lasers (HPDLs). Finite-element analysis (FEA) model and analytical solution model of the conduction-cooled package (CS) HPDL are established to analyze the thermomechanical behavior including normal stress, shearing stress, and displacement in reflowing process and working process. Moreover, in order to simulate and analyze the thermomechanical behavior in total process, reflowing thermal stress and displacement are considered as the residual stress and the initial condition of working process. We find that shearing stress is the origin of other thermomechanical behavior due to coefficient thermal expansion (CTE) mismatch, while both CTE mismatch and temperature gradient cause the thermal stress and displacement in working process. Although thermal stresses and displacement induced in reflowing process are larger than working process, the working process has great impact on smile and causes much worse total smile. The influence of different working temperatures on smile is also studied in total process with analytical solution, FEA, and experiment. For analytical solution, the total smile value is inversely proportional to the working temperature, while for FEA the smile value is proportional to the working temperature and FEA result accords with experimental result.
文章类型Article
关键词Component Architectures Semiconductor Device Packaging
学科领域Engineering, Manufacturing
WOS标题词Science & Technology ; Technology
DOI10.1109/TCPMT.2018.2820183
收录类别SCI
关键词[WOS]THERMAL-STRESSES ; ELECTRONIC ASSEMBLIES ; BIMETAL THERMOSTATS ; BARS ; STRAIN ; SMILE
语种英语
WOS研究方向Engineering ; Materials Science
项目资助者National Natural Science Foundation of China(61334010)
WOS类目Engineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary
WOS记录号WOS:000431915800014
引用统计
文献类型期刊论文
条目标识符http://ir.opt.ac.cn/handle/181661/30115
专题瞬态光学技术国家重点实验室
炬光科技有限公司
通讯作者Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
作者单位1.Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China
2.Univ Chinese Acad Sci, Sch Future Technol, Beijing 100049, Peoples R China
3.Focuslight Technol Co Inc, Xian 710077, Shaanxi, Peoples R China
推荐引用方式
GB/T 7714
Nie, Zhiqiang,Lu, Yao,Chen, Tianqi,et al. Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(5):818-829.
APA Nie, Zhiqiang.,Lu, Yao.,Chen, Tianqi.,Zhang, Pu.,Wu, Dihai.,...&Nie, ZQ .(2018).Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8(5),818-829.
MLA Nie, Zhiqiang,et al."Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8.5(2018):818-829.
条目包含的文件
文件名称/大小 文献类型 版本类型 开放类型 使用许可
Thermomechanical Beh(2340KB)期刊论文作者接受稿开放获取CC BY-NC-SA浏览 请求全文
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[Nie, Zhiqiang]的文章
[Lu, Yao]的文章
[Chen, Tianqi]的文章
百度学术
百度学术中相似的文章
[Nie, Zhiqiang]的文章
[Lu, Yao]的文章
[Chen, Tianqi]的文章
必应学术
必应学术中相似的文章
[Nie, Zhiqiang]的文章
[Lu, Yao]的文章
[Chen, Tianqi]的文章
相关权益政策
暂无数据
收藏/分享
文件名: Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays.pdf
格式: Adobe PDF
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。