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High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology
Wang, Boxue1; Jia, Yangtao1; Zhang, Haoyu1; Jia, Shiyin1; Liu, Jindou1; Wang, Weifeng1; Liu, Xingsheng1,2
2018
会议名称Components and Packaging for Laser Systems IV 2018
会议录名称Components and Packaging for Laser Systems IV
卷号10513
会议日期2018-01-30
会议地点San Francisco, CA, United states
出版者SPIE
产权排序2
摘要

An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report. © 2018 SPIE.

作者部门炬光科技有限公司
DOI10.1117/12.2289259
收录类别EI ; ISTP
ISBN号9781510615113
语种英语
ISSN号0277786X
引用统计
文献类型会议论文
条目标识符http://ir.opt.ac.cn/handle/181661/30042
专题炬光科技有限公司
瞬态光学技术国家重点实验室
作者单位1.Focuslight Technologies Inc., No. 56 Zhangba 6th Road, High-Tech Zone, Xi'an, Shaanxi; 710077, China
2.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, No. 17 Xinxi Road, Xi'an, Shaanxi; 710119, China
推荐引用方式
GB/T 7714
Wang, Boxue,Jia, Yangtao,Zhang, Haoyu,et al. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology[C]:SPIE,2018.
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