中文版 | English

在结果中检索

OPT OpenIR

浏览/检索结果: 共2条，第1-2条 帮助

限定条件                
已选(0)清除 条数/页：   排序方式：
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：221/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Characterization of Far Field of Diode Laser by Three Dimensional Measurement 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Liu, Hui;  Yuan, Zhiyuan;  Cui, Long;  Wu, Di;  Liu, Xingsheng
Adobe PDF(758Kb)  |  收藏  |  浏览/下载：196/1  |  提交时间：2015/12/04