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Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
Adobe PDF(2834Kb)  |  收藏  |  浏览/下载：242/1  |  提交时间：2018/12/03
Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance  
Effect of submount thickness on near-field bowing of laser diode arrays 期刊论文
Applied Optics, 2018, 卷号: 57, 期号: 28, 页码: 8407-8411
作者:  Zhang, Hongyou;  Chen, Tianqi;  Zhang, Pu;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1049Kb)  |  收藏  |  浏览/下载：174/3  |  提交时间：2018/11/02
Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：244/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging