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A compact killowatt-level QCW high-power semiconductor laser array based on dual-chip integration 会议论文
Semiconductor Lasers and Applications XII, Virtual, Online, China, 2022-12-05
作者:  Zhang, Pu;  Ren, Wenzhen;  Wang, Bo;  Zhu, Xiangping;  Yang, Junhong
Adobe PDF(512Kb)  |  收藏  |  浏览/下载：84/2  |  提交时间：2023/03/15
high-power semiconductor laser  packaging  dual-chip  
Standoff detection of explosive materials using time-gated UV-Raman spectroscopy 会议论文
AOPC 2021: Optical Spectroscopy and Imaging, Beijing, China, 2021-06-20
作者:  Wang, Bo;  Zhang, Pu;  Zhang, Shuyao;  Zhu, Xiangping;  Zhao, Wei
Adobe PDF(2173Kb)  |  收藏  |  浏览/下载：108/4  |  提交时间：2022/01/30
Standoff Raman  Explosive detection  UV–Raman spectroscopy  
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
Components and Packaging for Laser Systems VI, San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1435Kb)  |  收藏  |  浏览/下载：160/1  |  提交时间：2020/05/18
High-power diode lasers  spectral power distribution (SPD)  spectral broadening  temperature distribution  
Performance of high-power diode lasers operated at cryogenic temperature 会议论文
Semiconductor Lasers and Applications IX, Hangzhou, China, 2019-10-21
作者:  Zhang, Pu;  Wang, Mingpei;  Nie, Zhiqiang;  Yang, Wuhao
Adobe PDF(9455Kb)  |  收藏  |  浏览/下载：131/0  |  提交时间：2020/03/04
High-power diode lasers  cryogenic temperature  thermal characteristics  
Optimization of microchannel cooler of high power diode laser array package 会议论文
Components and Packaging for Laser Systems III 2017, San Francisco, CA, United states, 2017-01-31
作者:  Wu, Dihai;  Zhang, Pu;  Nie, Zhiqiang;  Liang, Xuejie;  Wang, Jingwei;  Liu, Xingsheng;  Wu, Dihai (wudihai@opt.cn)
Adobe PDF(1612Kb)  |  收藏  |  浏览/下载：249/2  |  提交时间：2017/06/08
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling;  Wang, Shuna;  Wu, Dihai;  Liu, Xingsheng
Adobe PDF(2218Kb)  |  收藏  |  浏览/下载：239/1  |  提交时间：2016/11/22
Computer Simulation  Electronics Packaging  High Power Lasers  Numerical Models  Occupational Risks  Optical Properties  Packaging  Power Semiconductor Diodes  Shear Stress  Thermal Stress  
A compact QCW conduction-cooled high power semiconductor laser array 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Zhu, Qiwen;  Zhang, Pu;  Wang, Shuna;  Wu, Dihai;  Nie, Zhiqiang;  Xiong, Lingling;  Song, Yunfei;  Liu, Xingsheng
Adobe PDF(1179Kb)  |  收藏  |  浏览/下载：279/3  |  提交时间：2016/11/22
Chip Scale Packages  Electronics Packaging  Finite Element Method  High Power Lasers  High Temperature Applications  Temperature  
Study of the key aspects in developing kW-level diode lasers for solid state laser pumping 会议论文
Proceedings - 2014 International Conference Laser Optics, LO 2014, St. Petersburg, Russia, 2014-06-30
作者:  Li, Xiaoning;  Wang, Jingwei;  Cai, Wanshao;  Hao, Bei;  Hou, Dong;  Liu, Hui;  Zhang, Pu;  Liu, Xingsheng
Adobe PDF(249Kb)  |  收藏  |  浏览/下载：252/2  |  提交时间：2015/03/31
3000W CW diode laser cladding system 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Lingling Xiong;  Min Wang;  Xiaobiao Wang;  Yanfang Zheng;  Di Wu;  Pu Zhang;  Xiaoning Li;  Zhenfu Wang;  Xingsheng Liu
Adobe PDF(7498Kb)  |  收藏  |  浏览/下载：565/1  |  提交时间：2013/01/16
Hard solder 20kW QCW Stack Array Diode Laser 会议论文
HIGH-POWER DIODE LASER TECHNOLOGY AND APPLICATIONS X, San Francisco, CA, JAN 22-24, 2012
作者:  Xiaoning Li;  Lijun Kang;  Jingwei Wang;  Pu Zhang;  Lingling Xiong;  Xingsheng Liu
Adobe PDF(1026Kb)  |  收藏  |  浏览/下载：695/3  |  提交时间：2013/01/16