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Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：533/2  |  提交时间：2018/04/25
High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology 会议论文
High-Power Diode Laser Technology and Applications X, San Francisco, CA, United states, January 22, 2012 - January 24, 2012
作者:  Wang, Jingwei;  Kang, Lijun;  Zhang, Pu;  Nie, Zhiqiang;  Li, Xiaoning;  Xiong, Lingling;  Liu, Xingsheng
Adobe PDF(2099Kb)  |  收藏  |  浏览/下载：526/1  |  提交时间：2013/03/08