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Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 期号: 5, 页码: 818-829
作者:  Nie, Zhiqiang;  Lu, Yao;  Chen, Tianqi;  Zhang, Pu;  Wu, Dihai;  Wang, Mingpei;  Xiong, Lingling;  Li, Xiaoning;  Wang, Zhenfu;  Liu, Xingsheng;  Nie, ZQ (reprint author), Chinese Acad Sci, State Key Lab Transient Opt & Photon, Xian Inst Opt & Precis Mech, Xian 710119, Shaanxi, Peoples R China.
Adobe PDF(2340Kb)  |  收藏  |  浏览/下载：252/1  |  提交时间：2018/05/31
Component Architectures  Semiconductor Device Packaging  
A kind of infrared expand depth of field vision sensor in low-visibility road condition for safety-driving 期刊论文
SENSOR REVIEW, 2016, 卷号: 36, 期号: 1, 页码: 7-13
作者:  Wang, Hui-feng;  Wang, Gui-ping;  Wang, Xiao-yan;  Ruan, Chi;  Chen, Shi-qin;  Wang, Hui-Feng (conquest8888@126.com)
Adobe PDF(384Kb)  |  收藏  |  浏览/下载：178/2  |  提交时间：2016/02/23
Image Processing  Infrared  Low-visibility  Depth Of Field  Traffic Safety  Highway Environment  
Packaging of high power semiconductor lasers 专著
New York:Springer, 2015
作者:  Liu, Xingsheng;  Zhao, Wei;  Xiong, Lingling;  Liu, Hui
Adobe PDF(23453Kb)  |  收藏  |  浏览/下载：369/1  |  提交时间：2017/07/18