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High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：263/2  |  提交时间：2018/04/25
Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文
Physics and Simulation of Optoelectronic Devices XXV, San Francisco, CA, United states, 2017-01-30
作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng
Adobe PDF(965Kb)  |  收藏  |  浏览/下载：195/1  |  提交时间：2017/05/27