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Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS V, San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(1529Kb)  |  收藏  |  浏览/下载：148/1  |  提交时间：2019/06/28
high power diode laser  thermal model  heat spreading  thermal resistance  finite element method (FEM)  
Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, Wuhan, China, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna;  Zhang, Pu;  Xiong, Lingling;  Li, Xiaoning;  Shen, Zenan
Adobe PDF(1806Kb)  |  收藏  |  浏览/下载：248/1  |  提交时间：2016/11/22
Chip Scale Packages  Defects  Degradation  Electronics Packaging  High Power Lasers  Laser Beam Welding  Power Semiconductor Diodes  Reliability  Reliability Analysis  Semiconductor Diodes  
Numerical simulation study on quantum efficiency characteristics of InP/InGaAs/InP infrared photocathode 会议论文
Infrared Technology and Applications, and Robot Sensing and Advanced Control, Beijing, China, 2016-05-09
作者:  Xu, Junkai;  Xu, Xiangyan;  Tian, Jinshou;  Luo, Duan;  Hui, Dandan
Adobe PDF(736Kb)  |  收藏  |  浏览/下载：145/1  |  提交时间：2017/03/10
Numerical simulation of surface-conduction electron-emitter 会议论文
, Beijing, China, 2015-04-27
作者:  Shen, Zhihua;  Wang, Xiao;  Wu, Shengli;  Tian, Jinshou
Adobe PDF(538Kb)  |  收藏  |  浏览/下载：215/3  |  提交时间：2016/02/02
Electron Emitter  Numerical Simulation  Cst Particle Studio  Surface-conduction Electron-emission  
Advances in Bonding Technology for High Power Diode Laser Bars 会议论文
COMPONENTS AND PACKAGING FOR LASER SYSTEMS, San Francisco, CA, 2015-02-09
作者:  Wang, Jingwei;  Li, Xiaoning;  Hou, Dong;  Feng, Feifei;  Liu, Yalong;  Liu, Xingsheng
Adobe PDF(1436Kb)  |  收藏  |  浏览/下载：252/0  |  提交时间：2015/12/04