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Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications 期刊论文
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2018, 卷号: 6, 期号: 4, 页码: 2245-2253
作者:  Feng, Jingjing;  Mei, Yunhui;  Li, Xianbin;  Lu, Guo-Quan
Adobe PDF(2834Kb)  |  收藏  |  浏览/下载：251/1  |  提交时间：2018/12/03
Electricity  Electronic Packaging  Joining Process  Nanoporous Materials  Thermal Resistance  
Studying Properties of Composite Nano-PAA-Au Array for the Optimal SERS Sensitivity 期刊论文
PLASMONICS, 2018, 卷号: 13, 期号: 2, 页码: 631-638
作者:  Sui, Chaofan;  Zhao, Wenxuan;  Wang, Kaige;  Ba, Hanqing;  Wang, Shuang;  Bai, Xiaohong;  Bai, Jintao;  Wang, KG (reprint author), Northwest Univ, Inst Photon & Photon Technol, Natl Key Lab Base Photoelect Technol & Funct Mat, Xian 710069, Shaanxi, Peoples R China.
Adobe PDF(3103Kb)  |  收藏  |  浏览/下载：269/0  |  提交时间：2018/04/12
Surface-enhanced Raman Scattering  Localized Surface Plasmon Resonance  Nano-paa-au Array  Electromagnetic Enhancement