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Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Fan, Yingmin;  Wang, Jingwei;  Cai, Lei;  Mitra, Thomas;  Hauschild, Dirk;  Zah, Chung-En;  Liu, Xingsheng
Adobe PDF(5638Kb)  |  收藏  |  浏览/下载：494/2  |  提交时间：2018/04/25
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
Components and Packaging for Laser Systems IV, San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou;  Wang, Weifeng;  Liu, Xingsheng
Adobe PDF(3178Kb)  |  收藏  |  浏览/下载：257/2  |  提交时间：2018/04/25
Lateral thermal dissipation of InP-based InGaAsP ridge waveguide laser 会议论文
Semiconductor Lasers and Applications VIII, Beijing, China, 2018-10-12
作者:  Li, Xiao;  Qiu, Bocang;  Ruiying, Zhang;  Yue, Zhao
Adobe PDF(623Kb)  |  收藏  |  浏览/下载：125/0  |  提交时间：2019/03/12