Xi'an Institute of Optics and Precision Mechanics,CAS
Buried semiconductor laser and manufacture thereof | |
其他题名 | Buried semiconductor laser and manufacture thereof |
NISHIDA TOSHIO; SUGIURA HIDEO; TAMAMURA TOSHIAKI | |
1992-10-20 | |
专利权人 | NIPPON TELEGR & TELEPH CORP |
公开日期 | 1992-10-20 |
授权国家 | 日本 |
专利类型 | 发明申请 |
摘要 | PURPOSE:To provide a semiconductor laser by a method wherein a semiconductor laminate is formed so as to fill a groove provided with a plane pattern in stripes. CONSTITUTION:A semiconductor layer 2 is formed on a semiconductor substrate Then, a semiconductor substrate body 9 provided with the semiconductor substrate 1 and a semiconductor layer 8 is formed. In succession, a groove 12 provided with a stripe-like plane pattern is provided to the semiconductor substrate body 9, and a semiconductor region 6 is formed. A semiconductor clad layer 21, a semiconductor guide layer 22, a semiconductor active layer 23, a semiconductor guide layer 24, and a semiconductor clad layer 25 are successively laminated on the semiconductor substrate body 9 to constitute a semiconductor laminate 20, where the semiconductor laminate 20 is formed so as to nearly fill the groove 12. In succession, a mask layer 10 is removed from the semiconductor substrate body 9, and then a protective film 30 is provided. Then, electrode layers 34 and 35 are formed on the protective film 30. |
其他摘要 | 用途:通过一种方法提供半导体激光器,其中形成半导体叠层以便填充具有条纹平面图案的凹槽。组成:在半导体衬底1上形成半导体层2.然后,形成设置有半导体衬底1和半导体层8的半导体衬底本体9。接着,在半导体基板主体9上设置具有条纹状的平面图案的槽12,形成半导体区域6。半导体覆层21,半导体引导层22,半导体有源层23,半导体引导层24和半导体覆层25依次层叠在半导体衬底本体9上以构成半导体叠层20,其中半导体叠层形成图20所示的结构,以便几乎填充沟槽12.接着,从半导体衬底本体9上除去掩模层10,然后提供保护膜30。然后,在保护膜30上形成电极层34和35。 |
申请日期 | 1991-03-25 |
专利号 | JP1992296078A |
专利状态 | 失效 |
申请号 | JP1991084695 |
公开(公告)号 | JP1992296078A |
IPC 分类号 | H01S5/00 | H01S3/18 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/87549 |
专题 | 半导体激光器专利数据库 |
作者单位 | NIPPON TELEGR & TELEPH CORP |
推荐引用方式 GB/T 7714 | NISHIDA TOSHIO,SUGIURA HIDEO,TAMAMURA TOSHIAKI. Buried semiconductor laser and manufacture thereof. JP1992296078A[P]. 1992-10-20. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
JP1992296078A.PDF(212KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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