Xi'an Institute of Optics and Precision Mechanics,CAS
Method of assembling vcsel chips on a sub-mount | |
其他题名 | Method of assembling vcsel chips on a sub-mount |
PRUIJMBOOM, ARMAND; DUMOULIN, RAIMOND LOUIS; MILLER, MICHAEL | |
2014-11-27 | |
专利权人 | KONINKLIJKE PHILIPS ELECTRONICS N V |
公开日期 | 2014-11-27 |
授权国家 | 美国 |
专利类型 | 发明申请 |
摘要 | The present invention relates to a method of assembling VCSEL chips (1) on a sub-mount (2). A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2). A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1). The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub-mount (2) and soldered to the sub-mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub-mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub-mount (2) is achieved without time consuming measures. |
其他摘要 | 本发明涉及一种在子底座( 2 )上组装VCSEL芯片( 1 )的方法。去湿层( 13 )沉积在VCSEL芯片( 1 )的连接侧,该连接侧将连接到子底座( 2) 的)。在子底座( 2 )的连接侧上沉积另一个去湿层( 13 ),该连接侧将连接到VCSEL芯片( 1 的)。去除润湿层( 13 )以图案化设计沉积或在沉积后形成图案以限定子底座上的连接区域( 21 )( 2) )和VCSEL芯片( 1 )。将焊料( 15 )施加到两个连接侧中的至少一个的连接区域( 21 )。将VCSEL芯片( 1 )放置在子底座上( 2 )并焊接到子底座( 2 )以进行电气和机械连接VCSEL芯片( 1 )和子底座( 2 )。利用所提出的方法,在没有耗时措施的情况下实现了子载体( 2 )上的VCSEL芯片( 1 )的高对准精度。 |
申请日期 | 2012-10-08 |
专利号 | US20140348192A1 |
专利状态 | 授权 |
申请号 | US14/350404 |
公开(公告)号 | US20140348192A1 |
IPC 分类号 | H01S5/022 | H01S5/028 | H01S5/30 | H01S5/024 | H01S5/42 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/86182 |
专题 | 半导体激光器专利数据库 |
作者单位 | KONINKLIJKE PHILIPS ELECTRONICS N V |
推荐引用方式 GB/T 7714 | PRUIJMBOOM, ARMAND,DUMOULIN, RAIMOND LOUIS,MILLER, MICHAEL. Method of assembling vcsel chips on a sub-mount. US20140348192A1[P]. 2014-11-27. |
条目包含的文件 | 条目无相关文件。 |
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