Xi'an Institute of Optics and Precision Mechanics,CAS
Semiconductor light-emitting device | |
其他题名 | Semiconductor light-emitting device |
SAITO, TAKAO; NOZAKI, TAKAHIKO | |
2015-07-07 | |
专利权人 | STANLEY ELECTRIC CO., LTD. |
公开日期 | 2015-07-07 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | A semiconductor light-emitting device including a favorable radiating structure can include a semiconductor light source sealed between a metallic cap having a light-emitting window and a metallic base attached on a heat sink plate. The semiconductor light-emitting device can also include a holder attaching the metallic base along the metallic cap between the holder and the heat sink plate to efficiently radiate heat generated from the light source, and a thermal interface material layer disposed between at least a top surface of the heat sink plate and an outer bottom surface of the holder so as to be able to enlarge each tolerance of parts composing the light-emitting device. Thus, the disclosed subject matter can provide semiconductor light-emitting devices including the favorable radiating structure, which can be employed for various lighting apparatuses including a headlight in a relatively small size by selecting the semiconductor light source incorporated in the devices. |
其他摘要 | 包括有利的辐射结构的半导体发光器件可以包括密封在具有发光窗口的金属盖和附着在散热板上的金属基底之间的半导体光源。半导体发光装置还可包括:保持器,沿着金属盖将金属基座附接在保持器和散热板之间,以有效地辐射从光源产生的热量;以及热界面材料层,设置在至少顶面之间散热板和支架的外底面的一部分,以便能够扩大构成发光装置的部件的每个公差。因此,所公开的主题可以提供包括有利的辐射结构的半导体发光器件,其可以通过选择结合在器件中的半导体光源而用于包括相对小尺寸的前灯的各种照明设备。 |
申请日期 | 2014-01-14 |
专利号 | US9076952 |
专利状态 | 授权 |
申请号 | US14/154821 |
公开(公告)号 | US9076952 |
IPC 分类号 | H01L33/00 | H01L33/64 | H01L33/48 |
专利代理人 | - |
代理机构 | KENEALY VAIDYA LLP |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/72261 |
专题 | 半导体激光器专利数据库 |
作者单位 | STANLEY ELECTRIC CO., LTD. |
推荐引用方式 GB/T 7714 | SAITO, TAKAO,NOZAKI, TAKAHIKO. Semiconductor light-emitting device. US9076952[P]. 2015-07-07. |
条目包含的文件 | ||||||
文件名称/大小 | 文献类型 | 版本类型 | 开放类型 | 使用许可 | ||
US9076952.PDF(1121KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论