Xi'an Institute of Optics and Precision Mechanics,CAS
Hybrid integrated circuit device | |
其他题名 | Hybrid integrated circuit device |
SAKAMOTO, NORIAKI; SHIMIZU, HISASHI; OTA, SUSUMU; KOBAYASHI, YOSHIYUKI | |
2002-12-03 | |
专利权人 | III HOLDINGS 2, LLC |
公开日期 | 2002-12-03 |
授权国家 | 美国 |
专利类型 | 授权发明 |
摘要 | In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 1 Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved.Flow-stopping means 36 made of a brazing material is formed around each of the light emitting diodes 10. Also the surface of the brazing material is used as a reflecting surface. |
其他摘要 | 在其中发光元件附着到印刷电路板的光照射装置中,增强了热辐射性能,并且实现了发光效率的提高和尺寸和重量的减小。覆盖有Ni的Cu图案形成在金属基板11上。发光元件11以串联电路的形式安装在图案上。形成串联连接的金属基板彼此并联连接。由于Ni具有优异的耐腐蚀性和高反射效率,因此基板本身的表面可用作反射板。为每个发光元件形成透镜37,从而可以进一步提高发光效率。在每个发光二极管10的周围形成由钎焊材料制成的止流装置36.此外,钎焊材料的表面也是如此。用作反射表面。 |
申请日期 | 2000-03-28 |
专利号 | US6489637 |
专利状态 | 授权 |
申请号 | US09/536730 |
公开(公告)号 | US6489637 |
IPC 分类号 | H01L25/075 | H01L33/00 | F21V29/00 | H01L23/28 | H01L33/54 | H01L33/60 | H01L33/62 |
专利代理人 | - |
代理机构 | FISH & RICHARDSON P.C. |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/72020 |
专题 | 半导体激光器专利数据库 |
作者单位 | III HOLDINGS 2, LLC |
推荐引用方式 GB/T 7714 | SAKAMOTO, NORIAKI,SHIMIZU, HISASHI,OTA, SUSUMU,et al. Hybrid integrated circuit device. US6489637[P]. 2002-12-03. |
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US6489637.PDF(1258KB) | 专利 | 开放获取 | CC BY-NC-SA | 请求全文 |
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