Hybrid integrated circuit device

OPT OpenIR > 半导体激光器专利数据库

	Hybrid integrated circuit device
其他题名	Hybrid integrated circuit device
	SAKAMOTO, NORIAKI; SHIMIZU, HISASHI; OTA, SUSUMU; KOBAYASHI, YOSHIYUKI
	2002-12-03
专利权人	III HOLDINGS 2, LLC
公开日期	2002-12-03
授权国家	美国
专利类型	授权发明
摘要	In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 1 Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved.Flow-stopping means 36 made of a brazing material is formed around each of the light emitting diodes 10. Also the surface of the brazing material is used as a reflecting surface.
其他摘要	在其中发光元件附着到印刷电路板的光照射装置中，增强了热辐射性能，并且实现了发光效率的提高和尺寸和重量的减小。覆盖有Ni的Cu图案形成在金属基板11上。发光元件11以串联电路的形式安装在图案上。形成串联连接的金属基板彼此并联连接。由于Ni具有优异的耐腐蚀性和高反射效率，因此基板本身的表面可用作反射板。为每个发光元件形成透镜37，从而可以进一步提高发光效率。在每个发光二极管10的周围形成由钎焊材料制成的止流装置36.此外，钎焊材料的表面也是如此。用作反射表面。
申请日期	2000-03-28
专利号	US6489637
专利状态	授权
申请号	US09/536730
公开（公告）号	US6489637
IPC 分类号	H01L25/075 \| H01L33/00 \| F21V29/00 \| H01L23/28 \| H01L33/54 \| H01L33/60 \| H01L33/62
专利代理人	-
代理机构	FISH & RICHARDSON P.C.
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/72020
专题	半导体激光器专利数据库
作者单位	III HOLDINGS 2, LLC
推荐引用方式 GB/T 7714	SAKAMOTO, NORIAKI,SHIMIZU, HISASHI,OTA, SUSUMU,et al. Hybrid integrated circuit device. US6489637[P]. 2002-12-03.

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