Manufacture of semiconductor laser element

OPT OpenIR > 半导体激光器专利数据库

	Manufacture of semiconductor laser element
其他题名	Manufacture of semiconductor laser element
	OSAWA KAZUHIRO; KAMATA TORU
	1991-02-14
专利权人	NEC CORP
公开日期	1991-02-14
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To decrease a case in size and to use a pellet effectively by a method wherein semiconductor laser pellets are mounted on heat sinks which are linked together, and the pellets are supplied with a current and selected basing on characteristics as they are mounted on the heat sinks. CONSTITUTION:A back electrode 1 of titanium-platinum-gold is provided to the rear side of a bar-like heat sink 7 of high resistive silicon, the primary face of the sink 7 is metallized with titanium-platinum-gold, and a pellet mounting electrode 2 and a wire-bonding electrode are formed electrically isolated from each other. The heat sink 7 is locally heated and the pellet 4 is mounted on the pellet mounting electrode 2 with solder, and the pellet 4 and the wire bonding electrode 3 are wire-bonded together through a bonding wire 5. Grooves 6 provided to the bar-like heat sink 7 so as to easily separate it into pieces. Then, a current is made to flow through the pellet 4 by making probes touch the pellet mounting electrode 2 and the wire bonding electrode 3 respectively, and the characteristics test of the pellet 4 such as I-L, I-V, wavelength, and the like and the operation test are made.
其他摘要	目的：通过一种方法减小外壳的尺寸并有效地使用颗粒，其中半导体激光颗粒安装在连接在一起的散热器上，并且颗粒被提供电流并根据特性选择，因为它们安装在散热片。组成：钛 - 金 - 金的背电极1提供在高阻硅的条状散热器7的后侧，水槽7的主面用钛 - 铂 - 金和金属颗粒金属化。安装电极2和引线键合电极形成为彼此电隔离。散热器7被局部加热，并且颗粒4通过焊料安装在颗粒安装电极2上，并且颗粒4和引线接合电极3通过接合线5引线接合在一起。提供给条形件的凹槽6-像散热器7一样，以便容易地将它分成碎片。然后，通过使探针分别接触颗粒安装电极2和引线接合电极3，以及颗粒4的特性测试，例如IL，IV，波长等，使电流流过颗粒4。进行操作测试。
申请日期	1989-06-29
专利号	JP1991034385A
专利状态	失效
申请号	JP1989169515
公开（公告）号	JP1991034385A
IPC 分类号	H01S5/00 \| H01S3/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/70933
专题	半导体激光器专利数据库
作者单位	NEC CORP
推荐引用方式 GB/T 7714	OSAWA KAZUHIRO,KAMATA TORU. Manufacture of semiconductor laser element. JP1991034385A[P]. 1991-02-14.

条目包含的文件
文件名称/大小	文献类型	版本类型	开放类型	使用许可
JP1991034385A.PDF（82KB）	专利		开放获取	CC BY-NC-SA	请求全文