Stem for semiconductor laser

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	Stem for semiconductor laser
其他题名	Stem for semiconductor laser
	YONEKURA HIROMI
	1983-09-29
专利权人	TOUSHIBA COMPONENTS KK
公开日期	1983-09-29
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To obtain a stem which has preferable heat dissipation by forming a lead wirings passing hole and a block engaging hole at a stem body and engaging the element holding block with the hole. CONSTITUTION:A lead wirings passing hole 21 and a block engaging hole 22 are opened at a stem body 20 made of glass sealing Fe alloy or Fe. The hole 22 is a semicircular through hole, engages a block 23 of preferable thermoconductive material such as Cu or the like, and is formed so that the body 20 and the lower surface are aligned in the same plane. Lead wirings are passed via a glass sealing material 25 through the hole 21, and secured simultaneously upon soldering of the block 23. According to this structure, even if it is treated at a high temperature, the thermal expansion difference between the seal 25 and the body 20 is small. Accordingly, the lead wirings can be effectively secured, and since the end face of the block 23 is contacted directly with a heat radiator, the heat dissipation can be largely improved.
其他摘要	目的：通过在杆体上形成引线布线通孔和块接合孔并使元件保持块与孔接合来获得具有优选散热性的杆。组成：引线穿过孔21和块接合孔22在由玻璃密封Fe合金或Fe制成的阀杆体20上开口。孔22是半圆形通孔，与诸如Cu等的优选导热材料的块23接合，并且形成为使得主体20和下表面在同一平面中对准。引线通过玻璃密封材料25通过孔21，并在焊接块23时同时固定。根据这种结构，即使在高温下处理，密封25和密封25之间的热膨胀差也是如此。身体20很小。因此，可以有效地固定引线，并且由于块23的端面直接与散热器接触，所以可以大大提高散热。
申请日期	1982-03-25
专利号	JP1983164285A
专利状态	失效
申请号	JP1982047700
公开（公告）号	JP1983164285A
IPC 分类号	H01S5/00 \| H01S5/022 \| H01S3/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/70473
专题	半导体激光器专利数据库
作者单位	TOUSHIBA COMPONENTS KK
推荐引用方式 GB/T 7714	YONEKURA HIROMI. Stem for semiconductor laser. JP1983164285A[P]. 1983-09-29.

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