Semiconductor laser mount

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	Semiconductor laser mount
其他题名	Semiconductor laser mount
	YAMAGISHI KENICHI; HORIKAWA KAZUO; ISHIKAWA HIROMI
	1986-09-26
专利权人	FUJI PHOTO FILM CO LTD
公开日期	1986-09-26
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To facilitate sticking a semiconductor laser mount to a predetermined position without discrepancy by a method wherein an adhesive filling ditch, linked with an adhesive inlet and outlet whose openings are on the surface of the semiconductor laser mount other than the adhesion surface, is provided on the adhesion surface which is to be stuck to a supporting stand in such a manner that the ditch nearly encircles the position to which the semiconductor laser is attached. CONSTITUTION:A semiconductor laser mount 1 is stuck to a supporting stand 6 by its adhesion surface 1a and an adhesive filling ditch 3 is provided on the adhesion surface 1a in such a manner that the ditch 3 nearly encircles the position to which the semiconductor laser 2 is attached. The ditch 3 is linked to an adhesive inlet 4 and outlet 5 whose openings are on the surface 1b of the semiconductor laser mount 1 other than the adhesion surface 1a. The adhesive is poured through the inlet 4 and fills the ditch 3 smoothly. After the semiconductor laser mount 1 is put on a predetermined position of the supporting stand 6, the adhesive is poured from the inlet 4. As the adhesion surface 1a is stuck to the supporting stand 6 with the adhesive filling the ditch 3, the adhesion surface 1a is not unevenly coated with the adhesive. Moreover, as the adhesive is in the ditch, the semiconductor laser mount 1 is hardly influenced by the volume shrinkage of the adhesive so that the discrepancy can be avoided.
其他摘要	用途：为了便于将半导体激光器支架固定到预定位置而没有差别，其中提供了一种粘合剂填充沟槽，其与粘合剂入口和出口连接，其开口位于半导体激光器支架的除粘合表面之外的表面上在粘合表面上粘贴到支撑架上，使得沟槽几乎环绕半导体激光器所附着的位置。组成：半导体激光器支架1通过其粘合表面1a粘在支撑架6上，并且粘合剂填充沟3设置在粘合表面1a上，使得沟槽3几乎环绕着支撑架3的位置。附接半导体激光器2。沟槽3连接到粘合剂入口4和出口5，其开口位于半导体激光器支架1的除粘合表面1a之外的表面1b上。通过入口4注入粘合剂并平滑地填充沟渠3。在将半导体激光器支架1放置在支撑架6的预定位置上之后，从入口4注入粘合剂。当粘合表面1a粘合到支撑架6上时，粘合剂填充沟槽3，粘合表面1a没有涂覆不均匀的粘合剂。此外，由于粘合剂在沟槽中，半导体激光器支架1几乎不受粘合剂的体积收缩的影响，因此差异可以避免。
主权项	-
申请日期	1985-03-20
专利号	JP1986216377A
专利状态	失效
申请号	JP1985056938
公开（公告）号	JP1986216377A
IPC 分类号	H01L21/52 \| H01L21/58 \| H01S5/00 \| H01S5/02 \| H01S5/40 \| H01S3/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/64144
专题	半导体激光器专利数据库
作者单位	FUJI PHOTO FILM CO LTD
推荐引用方式 GB/T 7714	YAMAGISHI KENICHI,HORIKAWA KAZUO,ISHIKAWA HIROMI. Semiconductor laser mount. JP1986216377A[P]. 1986-09-26.

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