Electronic component

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	Electronic component
其他题名	Electronic component
	AIKI KUNIO; SASAYAMA ATSUSHI; KAWASAKI TSUTOMU
	1987-12-01
专利权人	HITACHI LTD
公开日期	1987-12-01
授权国家	日本
专利类型	发明申请
摘要	PURPOSE:To make high frequency characteristics stable by fixing leads to conductive layers through conductive junctions, while the leads are connected to wires by an ultrasonic wave wire bonding and the conductive layers have an enough designated width which is prepared at the surface of reinforcing plate. CONSTITUTION:Leads 6 are so connected to wires by an ultrasonic wave wire bonding and are so fixed to a reinforcing plate 22 that there is an increase in the rigidity of the leads. Such a state of the leads makes it difficult to develop oscillation in the case of performing the ultrasonic wave wire bonding and causes the wire bonding to be carried out surely. In addition, as the leads 6 are fixed to the conductive layers 23 through conductive junctions 24 and the conductive layers have a given width which is prepared at the surface of the reinforcing plate 22, there are increased dimensions where an electric current flows substantially and also a smaller parastic inductance in a lead portion. Thus, the fixed leads make high frequency characteristics stable.
其他摘要	目的：通过导电结将引线固定到导电层，使高频特性稳定，同时通过超声波焊线将引线连接到导线，导电层具有足够的指定宽度，在加强板表面制备。组成：导线6通过超声波线焊接与导线连接，并固定在加强板22上，使导线的刚性增加。引线的这种状态使得在执行超声波线接合的情况下难以产生振荡并且确保进行引线接合。另外，由于引线6通过导电结24固定到导电层23，并且导电层具有在加强板22的表面处制备的给定宽度，所以电流基本上流动的尺寸增加，并且引线部分的较小的寄生电感。因此，固定引线使高频特性稳定。
主权项	-
申请日期	1986-05-26
专利号	JP1987276891A
专利状态	失效
申请号	JP1986119230
公开（公告）号	JP1987276891A
IPC 分类号	H01L23/50 \| G02B6/42 \| H01L21/60 \| H01S5/00 \| H01S3/18
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/63030
专题	半导体激光器专利数据库
作者单位	HITACHI LTD
推荐引用方式 GB/T 7714	AIKI KUNIO,SASAYAMA ATSUSHI,KAWASAKI TSUTOMU. Electronic component. JP1987276891A[P]. 1987-12-01.

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