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Optical equipment for shaping semiconductor laser beam
其他题名Optical equipment for shaping semiconductor laser beam
KITAJIMA HIROSHI; YOSHIDA TOMIYOSHI; MORISHITA KOJI; NAKATSUKA NOBUO
1987-05-28
专利权人OMRON TATEISI ELECTRONICS CO
公开日期1987-05-28
授权国家日本
专利类型发明申请
摘要PURPOSE:To arrange a laser ray in a desired beam shape, by providing a first lense group into which a semiconductor laser ray enters, a first mirror cylinder, a second lense group from which a laser beam is transmitted, and a second mirror cylinder, and moving relatively the mirror cylinders. CONSTITUTION:A first lense group 11 is held by a mirror cylinder 12, and screws are threaded on the internal and the external side surfaces of the mirror cylinder 12. The external side surface of the mirror cylinder 12 is screwed in a supporting part 13. The mirror cylinder 12 is held so as to be able to transfer in the direction of optical axis, and fixed to the supporting part 13 by a screw 13a. A second lense group 14 is held by a mirror cylinder 15 which is screwed in the inner surface of the mirror cylinder 12, and held so as to be able to transfer in the direction of optical axis. The mirror cylinder 15 is fixed to the mirror cylinder 12 by a ring 16 which screws in the inner surface of the mirror cylinder 12. By this constitution, the distance between the lense groups 11 and 14 is adjusted, and a beam 10a can be arranged in a desired position and diameter.
其他摘要目的:通过提供半导体激光进入的第一透镜组,第一镜筒,第二透镜组和第二镜筒,以所需的光束形状布置激光射线,第一镜筒,第二镜筒从中传输激光束,并相对移动镜筒。组成:第一透镜组11由镜筒12保持,并且螺钉拧在镜筒12的内侧表面和外侧表面上。镜筒12的外侧表面拧入支撑部分13中。镜筒12被保持为能够沿光轴方向传送,并通过螺钉13a固定到支撑部13。第二透镜组14由镜筒15保持,镜筒15拧入镜筒12的内表面,并被保持以便能够沿光轴方向传送。镜筒15通过环16固定在镜筒12上,环16拧入镜筒12的内表面。通过这种结构,调节镜头组11和14之间的距离,并且可以布置梁10a在所需的位置和直径。
主权项-
申请日期1985-11-18
专利号JP1987117381A
专利状态失效
申请号JP1985257965
公开(公告)号JP1987117381A
IPC 分类号H01S5/00 | H01S3/00 | H01S5/06 | H01S3/103
专利代理人-
代理机构-
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/63006
专题半导体激光器专利数据库
作者单位OMRON TATEISI ELECTRONICS CO
推荐引用方式
GB/T 7714
KITAJIMA HIROSHI,YOSHIDA TOMIYOSHI,MORISHITA KOJI,et al. Optical equipment for shaping semiconductor laser beam. JP1987117381A[P]. 1987-05-28.
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