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Dew suppressing means for semiconductor laser
其他题名Dew suppressing means for semiconductor laser
FURUYA YUUJI
1983-03-30
专利权人HITACHI KOKI KK
公开日期1983-03-30
授权国家日本
专利类型发明申请
摘要PURPOSE:To prevent dewing of window glass by loading to external circumference of protection cap a cylindrical cap having a thermal conductivity lower than that of said cap and freely mounting as required the existing window glass. CONSTITUTION:A dew suppressing cap 15 is fitted to a cap 11 of semiconductor laser in the existing structure. The caps 11, 15 are bonded and the N2 is filled therein. The cap 15 is made of the brass while the cap 11 is made of almost pure copper, and the window glass is fitted to the entire part of laser beam irradiation hole. According to this structure, the cap 11 is cooled but the cap 15 is restricted for drop of temperature. The thermal conductivity of glass 10 is only a fraction of that of cap and window area is considerably wide. Therefore, drop of temperature at the center of glass is as much restrited. Therefore, dewing is restricted only to the cylindrical edge surface of cap 15 and is not generated on the glass window 10 when the light emitting chip 9 under a high temperature environment is cooled up to a temperature of about 20 deg.C.
其他摘要用途:为了防止窗玻璃通过加载到保护帽的外圆周而结露,导热系数低于所述盖的圆柱形盖,并根据需要自由安装现有的窗玻璃。组成:露水抑制帽15安装在现有结构的半导体激光器的帽11上。盖11,15粘合并且N2填充在其中。盖15由黄铜制成,而盖11由几乎纯铜制成,并且窗玻璃安装在激光束照射孔的整个部分上。根据这种结构,盖子11被冷却,但盖子15受到温度下降的限制。玻璃10的导热率仅为盖子的导热率的一小部分,窗口面积相当宽。因此,玻璃中心的温度下降同样重新下降。因此,结露仅限于帽15的圆柱形边缘表面,并且当高温环境下的发光芯片9被冷却至约20℃的温度时,不会在玻璃窗10上产生结露。
主权项-
申请日期1981-09-26
专利号JP1983053877A
专利状态失效
申请号JP1981152398
公开(公告)号JP1983053877A
IPC 分类号H01S5/00 | H01S5/022 | H01S3/18
专利代理人-
代理机构-
文献类型专利
条目标识符http://ir.opt.ac.cn/handle/181661/62835
专题半导体激光器专利数据库
作者单位HITACHI KOKI KK
推荐引用方式
GB/T 7714
FURUYA YUUJI. Dew suppressing means for semiconductor laser. JP1983053877A[P]. 1983-03-30.
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