Xi'an Institute of Optics and Precision Mechanics,CAS
Laser processing device, control program for laser processing device, and control method | |
其他题名 | Laser processing device, control program for laser processing device, and control method |
TAKEDA HITOSHI | |
2016-09-01 | |
专利权人 | BROTHER KOGYO KABUSHIKI KAISHA |
公开日期 | 2016-09-01 |
授权国家 | 世界知识产权组织 |
专利类型 | 发明申请 |
摘要 | Provided is a laser processing device (1) capable of reducing degradation in processing quality at a processing-start section by a laser beam (L). A laser processing device (1) in a laser processing system (100) comprises a laser oscillation unit (12) and a galvano scanner (19), and is connected to a laser controller (5), a power supply unit (6), and a personal computer (7). A surface of a workpiece (W) is processed by scanning a pulse laser (L) from the laser oscillation unit (12) with the galvano scanner (19). At the time of starting processing of the workpiece (W), by control by the laser controller (5) and the personal computer (7), a third current supply period (Tc) during which a third current is supplied to an excitation semiconductor laser section (40) is started (S13), and upon the lapse of a standby period (Ts) from the start of the third current supply period (Tc), scanning by the galvano scanner (19) is started (S14). |
其他摘要 | 本发明提供一种激光加工装置(1),其能够通过激光束(L)降低加工开始部的加工品质的劣化。激光加工系统(100)中的激光加工装置(1)包括激光振荡单元(12)和电流扫描仪(19),并连接到激光控制器(5),电源单元(6),和个人电脑(7)。通过用电扫描器(19)扫描来自激光振荡单元(12)的脉冲激光(L)来处理工件(W)的表面。在开始处理工件(W)时,通过激光控制器(5)和个人计算机(7)的控制,将第三电流提供给激发半导体激光器的第三电流供应周期(Tc)开始(40),从第3电流供给期间(Tc)开始经过待机期间(Ts),开始电扫描器(19)的扫描(S14)。 |
主权项 | - |
申请日期 | 2016-02-26 |
专利号 | WO2016136945A1 |
专利状态 | 未确认 |
申请号 | PCT/JP2016/055816 |
公开(公告)号 | WO2016136945A1 |
IPC 分类号 | B23K26/00 | B23K26/082 | B23K26/60 | G02B26/10 | H01S3/00 | H01S5/022 | H01S5/042 |
专利代理人 | - |
代理机构 | - |
文献类型 | 专利 |
条目标识符 | http://ir.opt.ac.cn/handle/181661/62106 |
专题 | 半导体激光器专利数据库 |
作者单位 | BROTHER KOGYO KABUSHIKI KAISHA |
推荐引用方式 GB/T 7714 | TAKEDA HITOSHI. Laser processing device, control program for laser processing device, and control method. WO2016136945A1[P]. 2016-09-01. |
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