Xi'an Institute of Optics and Precision Mechanics,CAS
| Devices with quantum dots | |
| 其他题名 | Devices with quantum dots |
| LIANG, DI; KURCZVEIL, GEZA; BEAUSOLEIL, RAYMOND G.; FIORENTINO, MARCO | |
| 2019-03-21 | |
| 专利权人 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| 公开日期 | 2019-03-21 |
| 授权国家 | 美国 |
| 专利类型 | 发明申请 |
| 摘要 | An example method of manufacturing a semiconductor device. A first wafer may be provided that includes a first layer that contains quantum dots. A second wafer may be provided that includes a buried dielectric layer and a second layer on the buried dielectric layer. An interface layer may be formed on at least one of the first layer and the second layer, where the interface layer may be an insulator, a transparent electrical conductor, or a polymer. The first wafer may be bonded to the second wafer by way of the interface layer. |
| 其他摘要 | 制造半导体器件的示例方法。可以提供第一晶片，其包括含有量子点的第一层。可以提供第二晶片，其包括掩埋介电层和掩埋介电层上的第二层。界面层可以形成在第一层和第二层中的至少一个上，其中界面层可以是绝缘体，透明电导体或聚合物。第一晶片可以通过界面层结合到第二晶片。 |
| 主权项 | A method of manufacturing a semiconductor device, comprising: providing a first wafer that includes a first layer that contains quantum dots; providing a second wafer that includes a buried dielectric layer and a second layer on the buried dielectric layer; forming an interface layer on at least one of the first layer and the second layer; and bonding the first wafer to the second wafer by way of the interface layer, wherein the interface layer is one of: an insulator, a transparent electrical conductor, and a polymer. |
| 申请日期 | 2018-09-14 |
| 专利号 | US20190089129A1 |
| 专利状态 | 申请中 |
| 申请号 | US16/132070 |
| 公开（公告）号 | US20190089129A1 |
| IPC 分类号 | H01S5/343 | H01S3/23 | H01S3/063 | H01S5/02 | H01S5/34 | H01S5/042 | H01S5/32 | H01S5/347 | H01S5/026 | H01S5/10 |
| 专利代理人 | - |
| 代理机构 | - |
| 文献类型 | 专利 |
| 条目标识符 | http://ir.opt.ac.cn/handle/181661/57738 |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| 推荐引用方式 GB/T 7714 | LIANG, DI,KURCZVEIL, GEZA,BEAUSOLEIL, RAYMOND G.,et al. Devices with quantum dots. US20190089129A1[P]. 2019-03-21. |
| 条目包含的文件 | 条目无相关文件。 | |||||
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