Package, and method of manufacturing a package comprising an enclosure and an integrated circuit

OPT OpenIR > 半导体激光器专利数据库

	Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
其他题名	Package, and method of manufacturing a package comprising an enclosure and an integrated circuit
	MEEHAN, RUDI O'REILLY; AGARWAL, AKSHAT; JEFFERS, NICHOLAS M.
	2019-03-14
专利权人	NOKIA TECHNOLOGIES OY
公开日期	2019-03-14
授权国家	美国
专利类型	发明申请
摘要	There is disclosed a method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of providing at least one thermal contact connected to at least one of the components, and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink. There is also disclosed a package comprising an enclosure and an integrated circuit.
其他摘要	公开了一种制造用于集成电路的外壳的方法，该集成电路具有至少一个光学元件和至少一个电子元件，该方法包括以下步骤：提供连接到至少一个元件的至少一个热接触，并形成散热器与外壳一体形成，其中至少一个热接触件包括导电和导热金属，适于将热量从至少一个部件传递到散热器。还公开了一种包括外壳和集成电路的封装。
主权项	Method of manufacturing an enclosure for an integrated circuit having at least one optical component and at least one electronic component, the method comprising the steps of: providing at least one thermal contact connected to at least one of the components; and forming a heat sink that is integral with the enclosure, wherein the at least one thermal contact comprises electrically and thermally conductive metal suitable for transferring heat from the at least one component to the heat sink.
申请日期	2018-09-06
专利号	US20190081453A1
专利状态	申请中
申请号	US16/123400
公开（公告）号	US20190081453A1
IPC 分类号	H01S5/024
专利代理人	-
代理机构	-
文献类型	专利
条目标识符	http://ir.opt.ac.cn/handle/181661/57736
专题	半导体激光器专利数据库
作者单位	NOKIA TECHNOLOGIES OY
推荐引用方式 GB/T 7714	MEEHAN, RUDI O'REILLY,AGARWAL, AKSHAT,JEFFERS, NICHOLAS M.. Package, and method of manufacturing a package comprising an enclosure and an integrated circuit. US20190081453A1[P]. 2019-03-14.